PCB Application Engineering

PCB Manufacturing Built Around the Application

JetH PCB manufactures bare PCBs for automotive electronics, EV and energy systems, RF communication, industrial controls and other technically demanding products.

We do not reduce manufacturability to one headline number. Materials, copper construction, hole structures, impedance, mechanical limits and inspection requirements are evaluated as one production system.

Request a PCB Review

JetH Pro PCB Fab manufacturing bare printed circuit boards

Production Experience That Extends Beyond Generic PCB Fabrication

A capable PCB supplier must understand what the board is expected to survive, control and transmit.

JetH PCB connects fabrication decisions with current load, voltage, signal behavior, thermal exposure, mechanical stress and product-life expectations.

Every project receives its own material, stack-up, registration, surface-finish and verification strategy. We do not force unrelated applications into the same manufacturing recipe.

Applications We Manufacture

Automotive Electronics

EV Battery Systems

Energy Storage

Charging Equipment

Power Conversion

Industrial Control

RF Communication

Radar & Sensors

Test Equipment

High-Speed Data

LED & Lighting

Instrumentation

Automotive radar and sensor PCB — Automotive Radar & Sensor PCB

EV battery management PCB — EV Battery Management PCB

RF and microwave PCB — RF & Microwave PCB

Industrial control PCB — Industrial Control PCB

We Engineer the Board for Its Actual Operating Conditions

JetH PCB challenges weak assumptions before they become production defects. The application determines which risks deserve the most attention.

＋

Automotive Electronics

Vehicle Control, Sensing and Connectivity

Material traceability • Controlled impedance • Batch consistency • Electrical testing

Temperature cycling, vibration, electrical transients and long service life expose manufacturing weaknesses quickly. We align the fabrication plan with the needs of ADAS radar PCBs, vehicle sensors, control units, lighting modules and communication systems.

＋

New Energy Electronics

EV Power, Energy Storage and Charging

Heavy copper • Thermal management • High-voltage isolation • Copper verification

High current, elevated voltage and concentrated heat demand deliberate conductor geometry and isolation planning. Our engineers examine copper distribution, thermal paths, creepage, clearance and finished thickness for EV BMS PCBs, energy storage, on-board chargers, DC-DC converters and charging equipment.

＋

High-Frequency Electronics

RF, Radar and High-Speed Communication

RF materials • Hybrid stack-ups • Impedance control • Registration accuracy

At high frequencies, laminate selection and manufactured geometry directly affect electrical behavior. JetH Pro PCB Fab controls the relationship between dielectric properties, copper profile, trace dimensions and registration for radar, microwave, antenna and high-speed communication boards.

PCB Manufacturing Limits We State Clearly

JetH PCB publishes capability by delivery area because PCB prototype and volume conditions are not identical. Extreme values remain construction-dependent and must be approved together through DFM review.

Capability	Delivery Area <5 m²	Delivery Area ≥5 m²
Layer Count	1–40 layers	1–20 layers
Board Thickness	0.20–7.00 mm without solder mask 0.40–7.00 mm with solder mask	0.30–5.00 mm without solder mask 0.40–5.00 mm with solder mask
Maximum Finished Copper	Internal: 10 oz External: 20 oz	Internal: 5 oz External: 10 oz
Minimum Trace / Space	Internal: 3/3 mil at 1/2 oz External: 3/3 mil at 1/3 oz	Internal: 3/3 mil at 1/2 oz External: 3.5/4 mil at 1/3 oz
Finished Mechanical Hole	4–244 mil 0.10–6.20 mm	5–244 mil 0.13–6.20 mm
Laser Microvia	4–6 mil laser drill 4–5 mil for filled laser vias	4–6 mil laser drill 4–5 mil for filled laser vias
Controlled Impedance	±10%	±10%
Blind / Buried Vias	Mechanical blind and buried vias with fewer than 3 lamination cycles	Mechanical blind and buried vias with fewer than 2 lamination cycles
HDI Construction	1+n+1, 1+1+n+1+1, 2+n+2 and 3+n+3	1+n+1, 1+1+n+1+1, 2+n+2 and 3+n+3
Surface Finishes	ENIG, ENEPIG, OSP, lead-free HASL, leaded HASL, hard gold, soft gold, flash gold, immersion silver and immersion tin
Material Families	FR-4, high-Tg FR-4, Rogers, Taconic, Arlon, Nelco, PTFE and hybrid constructions

Application-Based Review

Give Us the Conditions Behind the Gerber Data

Gerber files describe geometry. They do not explain why the board needs a particular material, copper structure, isolation distance or inspection standard.

JetH Pro PCB Fab uses application information to identify manufacturing risks before tooling and production release.

Operating Environment

Temperature range, humidity, vibration, installation location and expected service life.

Electrical Demands

Working voltage, current, frequency, data rate, target impedance and isolation requirements.

Board Construction

Layer stack-up, material grades, base and finished copper, via architecture and surface finish.

Acceptance Evidence

Electrical testing, impedance reports, microsection analysis, material documentation and first-article approval.

PCB inspection and validation evidence — Inspection and validation evidence
AOI, electrical testing, microsection analysis and inspection records provide objective production evidence.

Put the Application in Front of Our Engineers

Send the Gerber data, stack-up, material requirements and operating conditions. JetH Pro PCB Fab will define the practical manufacturing and inspection path before production.