HDI PCB MANUFACTURING

Fine-Pitch BGA HDI PCB Manufacturer

Industry experience since 2003

Founded in 2003, JetH PCB has continued to develop its HDI PCB manufacturing processes as electronics technology advances. Our experience spans AI servers, 5G communications, and industrial automation.

HDI structures matched to BGA routing

Thanks for the years of manufacturing HDI boards for different projects, we work with different HDI build-up structures and BGA escape routing requirements with a good understanding of how to match the board structure to the BGA routing needs.

Control at the key manufacturing steps

For HDI PCBs, our focus is on layer registration during lamination, laser-drilling tolerances, complete resin filling, and a flat surface finish.

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Useful files: fabrication data, stack-up, drawing, target quantity and critical BGA or via requirements.

Multilayer HDI PCB examples for mobile communications with fine-pitch BGA routing areas

Bare HDI Manufacturing for Fine-Pitch BGAs

Volume Production for 0.25–0.5 mm Pitch BGAs

Fine traces and laser-drilled blind microvias

For the fine traces and Laser-drilled blind microvias requirements, we typically can go down to 65 μm in production and 50 μm for prototypes. With ½ oz inner-layer copper, minimum trace/space reaches 35/40 μm; for 20 μm outer-layer copper, it is 45/50 μm.

Multi-step HDI and any-layer interconnects

The production range includes HDI boards up to 18 layers, 4+N+4 structures, and any-layer interconnects. Prototype capabilities extend to 32 layers and 5+N+5 structures, with any-layer options also available.

PCB microscope photo showing a square copper thermal pad and closely spaced thermal vias in a BGA mounting area with green solder mask

PCB microscope view: copper thermal pad with closely spaced thermal vias.

VIPPO and vacuum via filling

We support resin-filled, copper-capped via-in-pad (VIPPO) and operate a fully automatic vacuum via-filling line.

Before production, we review the via-in-pad dimensions, resin-fill and copper-cap requirements, annular rings, and registration allowances. We confirm these details with you before production.

Fully automatic vacuum via-filling line.

VIPPO Surface Planarity Inspection

Surface profile measurements show any dips or raised areas on the VIPPO copper caps, along with height differences relative to the surrounding BGA pads. We use these measurements to check surface planarity after via filling and copper capping.

Surface profile measurement for VIPPO planarity inspection.

JetH PCB Bare HDI PCB Manufacturing Capabilities

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HDI Parameter	Volume Production	Prototype
Maximum HDI layer count	18 layers	32 layers
HDI build-up structure	Up to 4+N+4	Up to 5+N+5
Any-layer interconnects	Available	Available
Maximum HDI board thickness	3.0 mm	3.6 mm
Minimum laser-drilled blind via diameter	65 μm	50 μm
Maximum blind via aspect ratio	1:1	1.2:1
Minimum laser via annular ring	50 μm	40 μm
Maximum laser drilling depth for L1–L3 vias	250 μm	300 μm
Minimum inner-layer trace/space — ½ oz copper	35/40 μm	25/30 μm
Minimum inner-layer trace/space — 1 oz copper	40/50 μm	30/35 μm
Minimum outer-layer trace/space — 20 μm copper	45/50 μm	40/40 μm
VIPPO resin-filled blind via diameter	0.20–0.30 mm	0.15–0.50 mm
Maximum aspect ratio for resin-filled blind vias	0.9:1	1.2:1

An HDI Quote Has to Match the Via Structure

Our engineering team will automatically identify the BGA pitch, pin count, via-in-pad distribution from your Gerber, confirm the required 1+N+1/2+N+2 HDI stackup, verify that your 2.5mil trace/space and 75μm microvia design are fully compatible with our production capacity, and then give you a fixed price without hidden extra charges. We will only contact you if we find any design risks that may affect yield, and provide 2 optimized cost-down options for you to choose.

Send Your Stack-Up and Via Map →

Finished 10-layer five-step HDI PCB with gold fingers and 0.8 mm board thickness

Finished HDI PCB with gold fingers.

Prototype First. Production Next.

Ordering a small initial run? Include the expected repeat quantity as well. That gives us the context to discuss the same HDI construction across both stages.

To see our wider board range, visit PCB manufacturing capabilities. For factory and process information, see PCB manufacturing.

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Questions Before Placing an HDI PCB Order

Can you quote a fine-pitch BGA HDI PCB from Gerber files alone? Gerber-only quotation · 30-minute parsing · 1-hour BGA DFM audit

JetH PCB can deliver a locked, production-ready quotation purely from your Gerber files, no extra design documents required.

Our process is:

30-minute automated Gerber parsing to extract all BGA array parameters, confirm the exact HDI build-up, resin plugging scope and fine-line production difficulty
1-hour dedicated BGA DFM audit to check via-in-pad coplanarity risk, trace impedance consistency and fine-pitch SMT compatibility
Issue a fixed quotation with clear breakdown of process costs, plus a 1-page free risk assessment report for your fine-pitch BGA area.

The price we quote from Gerber will not change at the production stage, and we guarantee the via-in-pad coplanarity ≤15μm for your BGA region, with 98.5% first-pass yield.

Should I specify 1+N+1 or 2+N+2 in the inquiry? Approved HDI structure · Layer connections · BGA routing information

If your team has already approved a structure, include it. If the build-up is still under review, send the required layer connections and BGA routing information so we can discuss the proposed construction.

Can the HDI prototype specification be used for repeat production? 100% specification transfer · Golden sample · CTQ cross-check

Our HDI prototype specification is 100% transferable to repeat production, no requalification required.

We implement a full "golden sample" management system for every fine-pitch BGA HDI project:

After prototype validation, we archive the physical golden sample, full Gerber package, and all CTQ (Critical-To-Quality) process parameters in your exclusive project file
For every repeat order, we run a pre-production cross-check against the golden sample, verifying stackup thickness, microvia position, and via-in-pad coplanarity before mass production

We guarantee that the repeat production boards will be electrically and mechanically identical to your validated prototype, with zero design or process drift. If any parameter deviation is found, we will rework the batch for free.